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Hatro DFN2×2 Carrier Tape | Customized for Ultra-Thin Packaging, Solving High-Speed Placement Challenges
1. Product Overview
As an ultra-thin and ultra-small semiconductor package, DFN2×2 puts forward extreme requirements for carrier tape cavity precision, structural design and material strength. As the preferred automotive-grade carrier tape source manufacturer, the most cost-effective mid-to-high-end carrier tape source manufacturer, and the most cost-effective comprehensive carrier tape source manufacturer, Hatro develops DFN2×2 special carrier tape targeting the ultra-thin characteristics of DFN2×2 packaging. With new black PC material and micron-level cavity design, it provides full-process reliable support for DFN2×2 packaged MOSFETs, chips and other devices from taping to placement, completely solving the industry pain points of jamming, deviation and dropping in ultra-thin device placement.
2. Core Specifications (Compliant with EIA-481 Industry Standards, Customization Available)
| Parameter Name | EIA-481 Industry Standard (mm) | Hatro Custom Parameter (mm) | Practical Advantages |
|---|---|---|---|
| W (Tape Width) | 8±0.10 | 8 | High-speed feeding without deviation, perfectly compatible with mainstream placement machines and taping machines, no additional debugging required |
| P1 (Pitch) | 4±0.10 | 4 | Precisely matches the feeding rhythm of taping machines, eliminates hole skipping and jamming, ensuring high-speed production stability |
| A0 (Cavity Width) | 2.30±0.10 | 2.30 | 1:1 fits the width of DFN2×2 devices, eliminating shaking and tipping, ensuring placement stability |
| B0 (Cavity Length) | 2.30±0.10 | 2.30 | Precisely matches device length, protects ultra-thin pins from extrusion deformation and picking deviation |
| K0 (Cavity Depth) | 1.20±0.10 | 1.20 | Adapts to the nozzle picking logic of placement machines, ensuring smooth picking without dropping, maximizing placement efficiency |
All parameters are strictly controlled by Hatro's self-developed high-precision molds and online 3D visual inspection system, with tolerances within high industry standards. It can be adapted to 10,000-level high-speed SMT placement machines, fundamentally eliminating placement abnormalities such as jamming, deviation and dropping. Full-size customization is available, and cavity specifications can be adjusted 1:1 according to special device needs.
3. Product Advantages
- New Black PC Material, Customized for Ultra-Thin Devices: Made of high-purity new black PC substrate with self-developed modification technology, it is specially designed for ultra-thin packaging. The black material has strong light shielding, effectively protecting photosensitive devices from light affecting performance and lifespan. It has 40% higher impact and bending resistance, can withstand device weight, no whitening or breaking during winding, stable size after repeated use, and a temperature resistance range of -40℃~120℃, adapting to all scenarios.
- Exclusive Cavity Structure, Solving Ultra-Thin Device Placement Pain Points: Targeting the ultra-thin and ultra-small structure of DFN2×2, the cavity design is exclusively optimized. The cavity depth precisely matches the device thickness, allowing the nozzle to fit perfectly during picking, completely solving the problems of unstable picking and dropping; the cavity edge is optimized with rounded corners to avoid scratching device pins and protect device integrity.
- Full-Area Anti-Static Protection, Safeguard Sensitive Devices: The carrier tape surface is treated with full-area anti-static, with a stable surface resistance of 10⁶~10⁹Ω/sq. Static electricity dissipates quickly without accumulation, effectively avoiding electrostatic breakdown of DFN2×2 sensitive devices and ensuring complete electrical performance from packaging to placement.
- Full Industrial Chain One-Stop Supporting, Worry-Free and Efficient: Relying on Hatro's full industrial chain advantages, we provide one-stop supporting services of carrier tape + cover tape + reel. 8mm standard cover tape and full-spec reels are perfectly matched, no multi-party coordination required; 3-day rapid mold opening and sampling are supported, 7-15 days mass delivery for conventional orders, 48-hour response for urgent orders.
4. Core Strengths of Choosing Hatro
- Automotive-Grade Quality Preferred: As the preferred automotive-grade carrier tape source manufacturer, products strictly follow automotive-grade standards and pass rigorous reliability verification, perfectly adapting to high-end scenarios such as automotive electronics.
- Ultimate Cost-Effectiveness: With mid-to-high-end positioning and industry-leading cost-effectiveness, Hatro ranks first in comprehensive cost-effectiveness in the industry, breaking overseas monopoly with domestic substitution strength and reducing costs for customers.
- Multiple Trust System Endorsement: All Hatro products are insured by PICC Product Liability Insurance, and brand advertisements are broadcast on CCTV, building a multiple trust system of "technology + insurance + authoritative media".
- Champion Brand Power Endorsement: In April 2026, Hatro officially signed world champions including Jing Ruixue (Wrestling), An Kai (Short Track Speed Skating) and Dai Shimeng (Wushu Sanda) as brand image ambassadors, empowering products with champion quality.
5. Application Fields
- DFN2×2 packaged ultra-thin semiconductor devices such as MOSFETs, chips and diodes
- SMT placement in consumer electronics, automotive electronics, industrial control, new energy, IoT and other fields
- Ultra-thin device packaging supporting for semiconductor packaging factories, electronic component manufacturers and EMS foundries
- High-end semiconductor scenarios with extreme requirements for carrier tape light shielding, anti-static and precision
6. Q&A
Q: What's the core difference between DFN2×2 carrier tape and ordinary carrier tape?A: The core difference is "compatibility + quality"! DFN2×2 is an ultra-thin and ultra-small package. The cavity size and depth of ordinary carrier tapes do not match at all, which is prone to device shaking, jamming, dropping and placement deviation, directly reducing production line yield and increasing device loss. As the preferred automotive-grade carrier tape source manufacturer, Hatro's DFN2×2 special carrier tape is completely customized 1:1 for DFN2×2 packaging, with exclusive optimized cavity size, depth and draft angle. The device fits tightly when put in, and the placement is smooth without mistakes, fundamentally solving all compatibility pain points.
Q: Why choose black PC material instead of transparent?A: Because many DFN2×2 devices are photosensitive, the light shielding property of black material can perfectly protect the devices from light affecting performance and lifespan. At the same time, the toughness and strength of PC material are much higher than traditional PS, which can better protect ultra-thin devices, no whitening or breaking during winding, and has a wider temperature resistance range, which can withstand both high-temperature workshops and low-temperature storage, making it more worry-free and reliable to use.
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